DocumentCode
626578
Title
Exploring early design tradeoffs in 3DIC
Author
Franzon, Paul D. ; Priyadarshi, Shekhar ; Lipa, Steve ; Davis, William Rhett ; Thorolfsson, Thor
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
fYear
2013
fDate
19-23 May 2013
Firstpage
545
Lastpage
549
Abstract
This The key to gaining substantial benefit from the use of 3DIC technology is to create 3D specific designs that do more than recast a 2D optimal design into the third dimension. This paper explores some of the approaches to creating 3D specific designs and the CAD tools that can help in that exploration. The power advantages of 3D design are illustrated in details. Results from different partitioning approaches (function, modular and circuit) are presented, together with early results from a thermal pathfinding tool.
Keywords
circuit CAD; integrated circuit design; three-dimensional integrated circuits; 3D specific designs; 3DIC technology; CAD tools; circuit partitioning; function partitioning; modular partitioning; partitioning approaches; thermal pathfinding tool; Bandwidth; Face; Integrated circuit interconnections; Random access memory; Silicon; Through-silicon vias; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location
Beijing
ISSN
0271-4302
Print_ISBN
978-1-4673-5760-9
Type
conf
DOI
10.1109/ISCAS.2013.6571901
Filename
6571901
Link To Document