DocumentCode
626594
Title
Control methodology for on-chip switching power supplies for biomedical implants
Author
Abu Khater, Mohammad ; Sayilir, Serkan ; Byunghoo Jung
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear
2013
fDate
19-23 May 2013
Firstpage
614
Lastpage
617
Abstract
Recent developments in biomedical implants have increased the demand for on-chip power supplies. Switching power supplies provide high efficiency solution, which also serves in reducing the size of energy harvesting or energy storage devices. Hence, on-chip switching power supplies are ideal for implantable applications. However, they have the problem of higher ripple at the output than the conventional linear regulator due to the impractical values of on-chip components. In this paper, we present a new control methodology for on-chip switching power supply optimized for inductively powered implantable devices without any off-chip filtering components. The control methodology smoothens the transition between switching states based on pulse density modulation (PDM) feedback, in addition to an output voltage slope-limiting circuit. Simulated results of output ripple and efficiency based on 130nm RF-CMOS are shown. The control methodology reduce the ripple with minimal effect on power efficiency and without the need for any external filtering components.
Keywords
CMOS integrated circuits; circuit feedback; limiters; medical control systems; prosthetic power supplies; pulse modulation; radiofrequency integrated circuits; switching circuits; PDM; RF-CMOS; biomedical implant; energy harvesting device; energy storage device; inductively powered implantable device; linear regulator; off-chip filtering component; on-chip switching power supply; output voltage slope-limiting circuit; pulse density modulation feedback; size 130 nm; Partial discharges; Power supplies; Regulators; Switches; System-on-chip; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location
Beijing
ISSN
0271-4302
Print_ISBN
978-1-4673-5760-9
Type
conf
DOI
10.1109/ISCAS.2013.6571917
Filename
6571917
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