Title :
Design of reliable 2×VDD and 3×VDD series-parallel charge pumps in nanoscale CMOS
Author :
Yongtao Geng ; Dongsheng Ma
Author_Institution :
Integrated Syst. Design Lab., Univ. of Texas at Dallas, Richardson, TX, USA
Abstract :
With aggressive CMOS transistor scaling, reducing the risk of transistor breakdown has been becoming paramount in nano-era VLSI circuit designs. The paper presents design techniques and considerations on achieving reliable high-voltage series-parallel charge pumps. It adopts a stacked-MOSFET structure to achieve reliable 2×VDD and 3×VDD high-voltage switching. In addition, capacitor voltages are efficiently utilized to drive the power switches effectively and safely, such that any node-pair voltage of MOSFET power switch can be kept within the rated supply voltage (VDD), defined by the fabrication process. Furthermore, over-voltage stress and hot-carrier degradation can be overcome even in the transition phases. To verify the design concepts, a 3×VDD charge pump is designed with IBM 130-nm CMOS process. Simulation results demonstrate that the proposed charge pump provides a maximum output voltage of 4.5V and delivers up to 200μA load current with an input supply of 1.6V and a maximum efficiency of 81%.
Keywords :
CMOS integrated circuits; VLSI; electric breakdown; nanostructured materials; CMOS transistor scaling; MOSFET power switch; high-voltage series-parallel charge pumps; nanoera VLSI circuit designs; node-pair voltage; rated supply voltage; transistor breakdown; Charge pumps; Electric breakdown; Integrated circuit reliability; Logic gates; MOSFET; Stress;
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4673-5760-9
DOI :
10.1109/ISCAS.2013.6571944