Title :
CASL hypervisor and its virtualization platform
Author :
Chien-Te Liu ; Kuan-Chung Chen ; Chung-Ho Chen
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Abstract :
In this paper, we present an ARM-based hardwareassisted hypervisor, named CASL-Hypervisor, and a full system virtualization platform developed in SystemC which enables software/hardware co-simulation of virtual machine systems. CASL-Hypervisor takes advantage of an additional processor mode, extended memory management unit, configurable hardware traps and specialized hardware devices to virtualize unmodified Linux-based guest operating systems. By utilizing hardware extensions, development effort of CASL-Hypervisor can be greatly reduced and the hypervisor has achieved relatively low virtualization overhead. Evaluation is demonstrated on an approximately-timed manner so it is able to do fast software/hardware co-simulation and evaluations. We use the ARM-v7A instruction set simulator as the host processor. The hypervisor overhead can be quantified through instruction count ratio of guest operating system to the hypervisor. The results show that CASL-Hypervisor successfully virtualizes four guest operating systems with about 9.78% overhead.
Keywords :
Linux; hardware-software codesign; reduced instruction set computing; virtual machines; virtualisation; ARM-based hardware-assisted hypervisor; ARM-v7A instruction set simulator; CASL hypervisor; SystemC; configurable hardware traps; extended memory management unit; full-system virtualization platform; hardware extensions; host processor; hypervisor overhead; processor mode; software-hardware cosimulation; specialized hardware devices; unmodified Linux-based guest operating systems; virtual machine systems; virtualization overhead; virtualization platform; Hardware; Linux; Memory management; Operating systems; Virtual machine monitors; Virtual machining; Virtualization; full system simulation; full virtualization; hypervisor; instruction set simulator;
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4673-5760-9
DOI :
10.1109/ISCAS.2013.6572073