DocumentCode :
626857
Title :
Traffic- and Thermal-aware Adaptive Beltway Routing for three dimensional Network-on-Chip systems
Author :
Kun-Chih Chen ; Che-Chuan Kuo ; Hui-Shun Hung ; Wu, An-Yeu Andy
Author_Institution :
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear :
2013
fDate :
19-23 May 2013
Firstpage :
1660
Lastpage :
1663
Abstract :
The distribution of traffic and temperature in a high-performance three dimensional Network-on-Chip (3D NoC) system become more unbalanced because of chip stacking and applied minimal routing algorithms. To regulate the temperature under a certain thermal limit, the overheated nodes are usually throttled by run-time thermal management (RTM). Therefore, the network topology becomes a Non-Stationary Irregular Mesh (NSI-Mesh) and leads to heavy traffic congestion around the throttled nodes. Because of the traffic imbalance in the network, the system performance degrades sharply as temperature rises. In this paper, a Traffic- and Thermal-aware Adaptive Beltway Routing (TTABR) is proposed to balance both the distribution of the traffic and temperature in the network. The proposed TTABR can be applied to NSI-Mesh and regular mesh. The experimental results show that the proposed TTABR can achieve more balanced both traffic and temperature distribution, and the network throughput is improved by around 3.4~113% with less than 18% area overhead.
Keywords :
network routing; network topology; network-on-chip; temperature distribution; NSI-mesh; RTM; TTABR; chip stacking; high-performance 3D NoC system; high-performance three-dimensional network-on-chip system; minimal routing algorithm; network throughput; network topology; nonstationary irregular mesh; overheated nodes; regular mesh; run-time thermal management; temperature distribution; thermal limit; traffic congestion; traffic distribution; traffic imbalance; traffic-thermal-aware adaptive beltway routing; Network-on-chip; Nickel; Routing; Telecommunication traffic; Temperature distribution; Thermal management; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
ISSN :
0271-4302
Print_ISBN :
978-1-4673-5760-9
Type :
conf
DOI :
10.1109/ISCAS.2013.6572182
Filename :
6572182
Link To Document :
بازگشت