• DocumentCode
    626857
  • Title

    Traffic- and Thermal-aware Adaptive Beltway Routing for three dimensional Network-on-Chip systems

  • Author

    Kun-Chih Chen ; Che-Chuan Kuo ; Hui-Shun Hung ; Wu, An-Yeu Andy

  • Author_Institution
    Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2013
  • fDate
    19-23 May 2013
  • Firstpage
    1660
  • Lastpage
    1663
  • Abstract
    The distribution of traffic and temperature in a high-performance three dimensional Network-on-Chip (3D NoC) system become more unbalanced because of chip stacking and applied minimal routing algorithms. To regulate the temperature under a certain thermal limit, the overheated nodes are usually throttled by run-time thermal management (RTM). Therefore, the network topology becomes a Non-Stationary Irregular Mesh (NSI-Mesh) and leads to heavy traffic congestion around the throttled nodes. Because of the traffic imbalance in the network, the system performance degrades sharply as temperature rises. In this paper, a Traffic- and Thermal-aware Adaptive Beltway Routing (TTABR) is proposed to balance both the distribution of the traffic and temperature in the network. The proposed TTABR can be applied to NSI-Mesh and regular mesh. The experimental results show that the proposed TTABR can achieve more balanced both traffic and temperature distribution, and the network throughput is improved by around 3.4~113% with less than 18% area overhead.
  • Keywords
    network routing; network topology; network-on-chip; temperature distribution; NSI-mesh; RTM; TTABR; chip stacking; high-performance 3D NoC system; high-performance three-dimensional network-on-chip system; minimal routing algorithm; network throughput; network topology; nonstationary irregular mesh; overheated nodes; regular mesh; run-time thermal management; temperature distribution; thermal limit; traffic congestion; traffic distribution; traffic imbalance; traffic-thermal-aware adaptive beltway routing; Network-on-chip; Nickel; Routing; Telecommunication traffic; Temperature distribution; Thermal management; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
  • Conference_Location
    Beijing
  • ISSN
    0271-4302
  • Print_ISBN
    978-1-4673-5760-9
  • Type

    conf

  • DOI
    10.1109/ISCAS.2013.6572182
  • Filename
    6572182