• DocumentCode
    626922
  • Title

    Log-likelihood ratio algorithm for rate compatible modulation

  • Author

    Wengui Rao ; Yan Dong ; Fang Lu ; Shu Wang

  • Author_Institution
    Dept. of Electron. & Inf. Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2013
  • fDate
    19-23 May 2013
  • Firstpage
    1938
  • Lastpage
    1941
  • Abstract
    Seamless Rate Adaptation(SRA) based on rate compatible modulation(RCM) is a new receiver rate adaptive method, in which a block of bits are mapped into a series of symbols by a sparse matrix for high order modulation. According to channel state, the receiver select of the proper number of symbols to iterative demodulation by RCM. This system can achieves smooth rate adjustment under highly dynamic channel conditions. However, for fast implementation, the convolution in the horizontal processing and the vertical processing required lots of multipliers in RCM demodulation algorithm using Belief Propagation(BP), which beyond the current hardware. Therefore, it is difficult to make full use of the parallelizable of the BP. After analysised the principle of the RCM, by the proper deformation, we have proposed the LLR-RCM algorithm, in which we used the log likelihood ratio (LLR) to iterative demodulation. So the convolution in the horizontal processing are transformed into additions and a function table, all the multiplications in the vertical processing are converted to additions, what´s more, it save the normalization and make the possibility for fast implementation by hardware.
  • Keywords
    demodulation; iterative methods; telecommunication channels; RCM demodulation algorithm; belief propagation; dynamic channel conditions; high order modulation; iterative demodulation; log-likelihood ratio algorithm; rate compatible modulation; seamless rate adaptation; Adaptive systems; Convolution; Demodulation; Hardware; Probability distribution; Receivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
  • Conference_Location
    Beijing
  • ISSN
    0271-4302
  • Print_ISBN
    978-1-4673-5760-9
  • Type

    conf

  • DOI
    10.1109/ISCAS.2013.6572247
  • Filename
    6572247