• DocumentCode
    627107
  • Title

    Design methodology for inductive power transfer systems targeting high power implantable devices

  • Author

    Ho Yan Leung ; McCormick, Daniel ; Budgett, David ; Hu, Aiguo Patrick

  • Author_Institution
    Auckland Bioeng. Inst., Univ. of Auckland, Auckland, New Zealand
  • fYear
    2013
  • fDate
    19-23 May 2013
  • Firstpage
    2787
  • Lastpage
    2791
  • Abstract
    Developing a resonant inductively powered system for implantable devices is difficult due to the constraints on the operating coupling range, power level, and size. It is not trivial to determine the suitable resonant topology, tuning capacitors, power transfer coils, and operating frequency. Often the system parameters, such as the operating frequency, are designed using nominal values or a trial and error approach. We present a detailed numerical model which included frequency dependent parameters to accurately model the resonant system of an inductive power system, so that unexpected characteristics that might be hidden through approximations will be revealed. A procedure based on numerical simulation in the frequency domain is proposed to determine the resonant topology and tuning capacitances for achieving maximum efficiency with a set of power transfer coils across the specified operating coupling and loading conditions. A wireless power supply has been designed using this methodology, which increased the power efficiency by 4% on average over the full operating conditions.
  • Keywords
    frequency-domain analysis; inductive power transmission; numerical analysis; power capacitors; power supply quality; frequency dependent parameters; frequency domain; high power implantable devices; inductive power system; inductive power transfer systems; numerical simulation; power transfer coils; resonant inductively powered system; resonant system; resonant topology; tuning capacitors; wireless power supply; Capacitors; Coils; Couplings; RLC circuits; Resonant frequency; Topology; Tuning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
  • Conference_Location
    Beijing
  • ISSN
    0271-4302
  • Print_ISBN
    978-1-4673-5760-9
  • Type

    conf

  • DOI
    10.1109/ISCAS.2013.6572457
  • Filename
    6572457