• DocumentCode
    627113
  • Title

    Fast and improved seam carving with strip partition and neighboring probability constraints

  • Author

    Lifang Wu ; Lianchao Cao ; Chang Wen Chen

  • Author_Institution
    Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China
  • fYear
    2013
  • fDate
    19-23 May 2013
  • Firstpage
    2812
  • Lastpage
    2815
  • Abstract
    Seam carving is an effective way of image retargeting. However, existing seam carving schemes often come with unacceptable artifacts and are quite time consuming. In this paper, we propose a fast seam carving scheme with strip partition and neighboring probability constraints to resolve these two problems simultaneously. Firstly, we split the original image into several strips of equal space and we estimate the importance of each strip by its average saliency values. This partition results that more seams are removed from the strips consisting of more unimportant regions while fewer seams are removed from that of more important regions. Then, we establish the adjacency relationship by maximum correlation [8]. The neighboring probability is obtained to describe the neighboring relationship between the seams. Finally, by combining the neighboring probability and their accumulated energy, least important seams are removed. The neighboring probability constraint ensures that the seam removal is distributed to avoid abrupt changes in the scene. This leads to an improved quality in the resized image. The experimental results show that the proposed approach performs better than the state-of-the-art seam carving schemes.
  • Keywords
    image enhancement; image segmentation; probability; accumulated energy; image retargeting; neighboring probability constraints; resized image; saliency values; seam carving; strip partition; unacceptable artifacts; Correlation; Educational institutions; Image resolution; Search problems; Strips; Visualization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
  • Conference_Location
    Beijing
  • ISSN
    0271-4302
  • Print_ISBN
    978-1-4673-5760-9
  • Type

    conf

  • DOI
    10.1109/ISCAS.2013.6572463
  • Filename
    6572463