DocumentCode
627394
Title
Novel half mode substrate integrated waveguide power amplifier
Author
Zhebin Wang ; Chan-Wang Park
Author_Institution
Electr. Eng., Univ. du Quebec a Rimouski, Rimouski, QC, Canada
fYear
2013
fDate
7-9 April 2013
Firstpage
1
Lastpage
3
Abstract
In this paper, a novel half mode substrate integrated waveguide (HMSIW) 10W power amplifier (PA) designed with HMSIW matching network (MN) is presented for the first time. The HMSIW-based matching network (MN) is designed with microstrip-to-HMSIW transition and an inductive metalized post in HMSIW. The impedance matching for the fundamental frequency 2.14 GHz is realized by moving the position of the inductive metalized post in the HMSIW. Both the input and output MNs are designed with the proposed HMSIW-based MN concept. One HMSIW-based 10W PA using GaN HEMT at 2.14 GHz is designed, fabricated, and measured. The proposed HMSIW-based PA can be easily connected with any microstrip or SIW-based circuit. Measured results show that the maximum power added efficiency (PAE) is 72.2 % with 40.7 dBm output power and the maximum gain is 20.1 dB. At the design frequency of 2.14 GHz, the size of the proposed HMSIW-based PA is comparable with other microstrip-based PAs.
Keywords
HEMT circuits; UHF power amplifiers; impedance matching; substrate integrated waveguides; waveguide transitions; GaN; HEMT; frequency 2.14 GHz; gain 20.1 dB; half mode power amplifier; inductive metalized post; matching network; microstrip-HMSIW transition; power 10 W; substrate integrated waveguide power amplifier; Capacitors; HEMTs; Manganese; Microstrip; GaN HEMT; half mode substrate integrated waveguide (HMSIW); matching network (MN); power added efficiency (PAE); power amplifier (PA);
fLanguage
English
Publisher
ieee
Conference_Titel
Wireless and Microwave Technology Conference (WAMICON), 2013 IEEE 14th Annual
Conference_Location
Orlando, FL
Print_ISBN
978-1-4673-5536-0
Electronic_ISBN
978-1-4673-5535-3
Type
conf
DOI
10.1109/WAMICON.2013.6572749
Filename
6572749
Link To Document