• DocumentCode
    627394
  • Title

    Novel half mode substrate integrated waveguide power amplifier

  • Author

    Zhebin Wang ; Chan-Wang Park

  • Author_Institution
    Electr. Eng., Univ. du Quebec a Rimouski, Rimouski, QC, Canada
  • fYear
    2013
  • fDate
    7-9 April 2013
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    In this paper, a novel half mode substrate integrated waveguide (HMSIW) 10W power amplifier (PA) designed with HMSIW matching network (MN) is presented for the first time. The HMSIW-based matching network (MN) is designed with microstrip-to-HMSIW transition and an inductive metalized post in HMSIW. The impedance matching for the fundamental frequency 2.14 GHz is realized by moving the position of the inductive metalized post in the HMSIW. Both the input and output MNs are designed with the proposed HMSIW-based MN concept. One HMSIW-based 10W PA using GaN HEMT at 2.14 GHz is designed, fabricated, and measured. The proposed HMSIW-based PA can be easily connected with any microstrip or SIW-based circuit. Measured results show that the maximum power added efficiency (PAE) is 72.2 % with 40.7 dBm output power and the maximum gain is 20.1 dB. At the design frequency of 2.14 GHz, the size of the proposed HMSIW-based PA is comparable with other microstrip-based PAs.
  • Keywords
    HEMT circuits; UHF power amplifiers; impedance matching; substrate integrated waveguides; waveguide transitions; GaN; HEMT; frequency 2.14 GHz; gain 20.1 dB; half mode power amplifier; inductive metalized post; matching network; microstrip-HMSIW transition; power 10 W; substrate integrated waveguide power amplifier; Capacitors; HEMTs; Manganese; Microstrip; GaN HEMT; half mode substrate integrated waveguide (HMSIW); matching network (MN); power added efficiency (PAE); power amplifier (PA);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless and Microwave Technology Conference (WAMICON), 2013 IEEE 14th Annual
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4673-5536-0
  • Electronic_ISBN
    978-1-4673-5535-3
  • Type

    conf

  • DOI
    10.1109/WAMICON.2013.6572749
  • Filename
    6572749