DocumentCode :
627643
Title :
Power electronics thermal packaging and reliability
Author :
McCluskey, F. Patrick ; Bar-Cohen, Avram
Author_Institution :
Dept. of Mech. Eng., Univ. of Maryland, College Park, MD, USA
fYear :
2013
fDate :
16-19 June 2013
Firstpage :
1
Lastpage :
168
Abstract :
Presents the power point presentations from the conference proceedings. Power electronics is the critical enabling technology at the intersection of renewable power generation, reliable power distribution and transmission, and efficient power utilization and storage. Issues of compact and high power density packaging, thermal management and reliability are the most important research areas for realizing the full potential of power electronics.
Keywords :
power consumption; power distribution reliability; power electronics; power transmission reliability; thermal management (packaging); compact power density packaging; high power density packaging; power distribution reliability; power electronics thermal packaging; power storage efficiency; power transmission reliability; power utilization efficiency; renewable power generation; thermal management; Awards activities; Conferences; Educational institutions; Electronic packaging thermal management; Packaging; Power electronics; Technological innovation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Transportation Electrification Conference and Expo (ITEC), 2013 IEEE
Conference_Location :
Detroit, MI
Print_ISBN :
978-1-4799-0146-3
Type :
conf
DOI :
10.1109/ITEC.2013.6573464
Filename :
6573464
Link To Document :
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