Title :
Benefits of three-dimensional circuit stacking for image sensors
Author :
Guezzi-Messaoud, Fadoua ; Dupret, A. ; Peizerat, Arnaud ; Blanchard, Yves
Author_Institution :
CEA-LETI-MINATEC, Grenoble, France
Abstract :
In this paper, the potential benefits of image sensor three-Dimensional integration are evaluated. A case study on a High Dynamic Range (HDR) image sensor is done with performance comparison of the architecture developed for the 3D technology and the one used for the 2D integration. It specifically focuses on the power consumption where it shows that the 3D architecture can bring a decrease of the power consumption of a factor of at least 2.5 while keeping the same image sensor performances and even improving image quality.
Keywords :
image sensors; three-dimensional integrated circuits; high dynamic range image sensor; image quality; power consumption; three-dimensional circuit stacking; Arrays; Capacitance; Image sensors; Integrated circuit interconnections; Power demand; Stacking;
Conference_Titel :
New Circuits and Systems Conference (NEWCAS), 2013 IEEE 11th International
Conference_Location :
Paris
Print_ISBN :
978-1-4799-0618-5
DOI :
10.1109/NEWCAS.2013.6573597
