DocumentCode
627764
Title
Benefits of three-dimensional circuit stacking for image sensors
Author
Guezzi-Messaoud, Fadoua ; Dupret, A. ; Peizerat, Arnaud ; Blanchard, Yves
Author_Institution
CEA-LETI-MINATEC, Grenoble, France
fYear
2013
fDate
16-19 June 2013
Firstpage
1
Lastpage
4
Abstract
In this paper, the potential benefits of image sensor three-Dimensional integration are evaluated. A case study on a High Dynamic Range (HDR) image sensor is done with performance comparison of the architecture developed for the 3D technology and the one used for the 2D integration. It specifically focuses on the power consumption where it shows that the 3D architecture can bring a decrease of the power consumption of a factor of at least 2.5 while keeping the same image sensor performances and even improving image quality.
Keywords
image sensors; three-dimensional integrated circuits; high dynamic range image sensor; image quality; power consumption; three-dimensional circuit stacking; Arrays; Capacitance; Image sensors; Integrated circuit interconnections; Power demand; Stacking;
fLanguage
English
Publisher
ieee
Conference_Titel
New Circuits and Systems Conference (NEWCAS), 2013 IEEE 11th International
Conference_Location
Paris
Print_ISBN
978-1-4799-0618-5
Type
conf
DOI
10.1109/NEWCAS.2013.6573597
Filename
6573597
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