• DocumentCode
    627768
  • Title

    Proximity distance estimation based on capacitive coupling between 1mm3 sensor nodes

  • Author

    Shinada, Takuro ; Hashimoto, Mime ; Onoye, Takao

  • Author_Institution
    Dept. Inf. Syst. Eng., Japan Univ., Osaka, Japan
  • fYear
    2013
  • fDate
    16-19 June 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We are working toward actualizing a real-time 3D modeling system. It uses a sensor network that distributes many 1 mm3-class sensor nodes in plastic clay. The distributed sensors sense distances between them, and the sensor network collects the distance information for recognizing object shape by calculating relative positions of nodes based on the collected node-to-node distances. This paper proposes a distance estimation method based on capacitive coupling between sensor nodes for the 3D modeling system. An electrical signal is transmitted through a closed loop composed of node-to-node capacitive coupling, and the signal attenuation is used for the distance estimation. We investigate gain and directivity of the signal transmission with electric field and circuit simulation to explore appropriate electrode designs for the proposed method and evaluate the feasibility of the node localization with the proposed distance estimation method.
  • Keywords
    distributed sensors; object recognition; solid modelling; capacitive coupling; circuit simulation; closed loop; distance information; electric field; electrical signal; electrode designs; node localization; node relative position; node-to-node capacitive coupling; node-to-node distances; object shape recognition; plastic clay; proximity distance estimation; real-time 3D modeling system; sensor network; sensor nodes; signal attenuation; signal transmission directivity; signal transmission gain; Computational modeling; Couplings; Electrodes; Estimation error; Integrated circuit modeling; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    New Circuits and Systems Conference (NEWCAS), 2013 IEEE 11th International
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4799-0618-5
  • Type

    conf

  • DOI
    10.1109/NEWCAS.2013.6573601
  • Filename
    6573601