DocumentCode
62815
Title
Proper Orthogonal Decomposition-Based Modeling Framework for Improving Spatial Resolution of Measured Temperature Data
Author
Ghosh, Rajesh ; Joshi, Yash
Author_Institution
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
4
Issue
5
fYear
2014
fDate
May-14
Firstpage
848
Lastpage
858
Abstract
This paper presents a proper orthogonal decomposition (POD)-based reduced-order modeling framework to improve spatial resolution of measured temperature data in an air-cooled data center. This data-driven approach is applied on transient air temperature data, acquired at the exhaust of a server simulator rack. Temperature data is collected by a distributed thermocouple network at 1 Hz sampling frequency following a step impulse in the rack heat load. The input data are organized in a 2-D array, comprising transient temperature signals measured at various spatial locations. Because its computational time scales logarithmically with the input size, the proposed POD-based approach is potentially useful as an efficient tool for handling large transient data sets. With spatial location being the parameter for the input data matrix, the proposed approach is suitable for rapid synthesis of transient temperature data at new spatial locations. The comparison between POD-based local air temperature predictions and corresponding data indicates a maximum prediction uncertainty of 3.2%, and root mean square prediction uncertainty of 1.9%.
Keywords
air conditioning; atmospheric temperature; computer centres; reduced order systems; sustainable development; thermocouples; POD-based local air temperature predictions; POD-based reduced-order modeling framework; air-cooled data center; data matrix; distributed thermocouple network; frequency 1 Hz; proper orthogonal decomposition -based reduced-order modeling framework; rack heat load; root mean square prediction; server simulator rack; transient air temperature data; Cooling; Servers; Spatial resolution; Temperature distribution; Temperature measurement; Temperature sensors; Transient analysis; Computational sustainability; data center (DC); energy efficiency; live temperature streaming; proper orthogonal decomposition (POD); regression analysis; sensor placement; sensor placement.;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2013.2291791
Filename
6782749
Link To Document