Title :
Table of contents
Abstract :
The following topics are dealt with: 3D assembly and reliability; 3D materials and processing; novel interconnections; reliability test methods; directions in packaging; optical interconnects; interposers; 3D reliability and packaging challenges; advanced flip chip technologies; manufacturing technology; biomedical electronics; high brightness LEDs and materials; 3D processing and technology; 3D TSV interconnects reliability; flip chip assembly; adhesives and underfill materials; thermal and mechanical modeling and simulation; solder; power and signal integrity; 3D microbump structures and silicon to silicon bonding; wafer level and embedded packaging; drop and dynamic mechanical reliability; substrates; electrical modeling and measurements; MEMS and sensor packaging; and wirebond technology.
Keywords :
assembling; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; light emitting diodes; micromechanical devices; optical interconnections; sensors; solders; three-dimensional integrated circuits; wafer level packaging; 3D TSV interconnects reliability; 3D assembly; 3D materials; 3D microbump structures; 3D processing; 3D reliability; MEMS; adhesives; advanced flip chip technologies; biomedical electronics; drop; dynamic mechanical reliability; electrical modeling; embedded packaging; flip chip assembly; high brightness LED; interconnections; interposers; manufacturing technology; mechanical modeling; optical interconnects; packaging challenges; power integrity; reliability test methods; sensor packaging; signal integrity; silicon to silicon bonding; solder; substrates; thermal modeling; underfill materials; wafer level packaging; wirebond technology;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4799-0233-0
DOI :
10.1109/ECTC.2013.6575538
