DocumentCode :
628390
Title :
Single-chip 4 TX + 4 RX optical module based on holey SiGe transceiver IC
Author :
Doany, F.E. ; Kuchta, D.M. ; Rylyakov, A.V. ; Baks, C.W. ; Libsch, Frank ; Schow, C.L.
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2013
fDate :
28-31 May 2013
Firstpage :
268
Lastpage :
273
Abstract :
Optical 4 + 4 transceivers based on holey Optochip design using IBM BiCMOS8HP technology have been successfully assembled and characterized. The transceiver Optochip consists of an 8-channel single chip SiGe IC, containing all of the transmitter (TX) and receiver (RX) amplification circuitry, with flip-chip attached 4-channel VCSEL and photodiode arrays. Optical access to the conventional topside emitting 850-nm optoelectronic arrays is achieved through optical vias (holes) integrated into the transceiver IC. A laser ablation process was used to fabricate the 8 optical vias in individual SiGe ICs. For the Optochip assembly, the 2 optoelectronic arrays are sequentially flip-chip soldered to the IC using AuSn solder. The Optochips were subsequently flip-chip soldered to 8 mm × 8 mm high-speed high-density organic carriers forming the complete transceiver module. Electrical I/O is provided through BGA pads on 0.8mm pitch at the bottom of the module while optical access is provided through the 8 optical vias through the backside of the IC. The fully assembled transceiver modules are soldered to a test card for high speed evaluation. The Nelco 4000 test card contains a BGA site in the center for attachment of the optical transceiver module and differential high-speed transmission lines routed from high-speed electrical connectors to the module TX inputs and RX outputs. The optical inputs/outputs to the Optochip are coupled to MMF probes through the optical vias. Eye-diagrams were measured for TX outputs as well as TX-to-RX links at data rates 20 Gb/s to 38 Gb/s. Measurements on all 8 optical links between 2 transceiver modules showed all operate error free (BER <; 10-12) up to 36 Gb/s. This record per channel data rate for a parallel optical transceiver is achieved using feed forward equalization (FFE) circuitry incorporated in the SiGe IC. At 36 Gb/s, the transceiver module achieves a bidirectional aggregate bandwidth of 144 Gb/s with power effic- ency of 20 pJ/bit for each TX-RX link.
Keywords :
BiCMOS integrated circuits; Ge-Si alloys; ball grid arrays; electric connectors; flip-chip devices; gold compounds; holey fibres; optical interconnections; optical receivers; optical transceivers; optoelectronic devices; soldering; 8-channel single chip IC; AuSn; BGA; FFE circuitry; IBM BiCMOS8HP technology; MMF probes; Nelco 4000 test card; SiGe; TX-RX link; bidirectional aggregate bandwidth; bit rate 144 Gbit/s; bit rate 20 Gbit/s to 38 Gbit/s; differential high-speed transmission lines; electrical I/O; eye-diagrams; feed forward equalization circuitry; flip-chip attached 4-channel VCSEL; flip-chip soldering; high speed evaluation; high-speed electrical connectors; high-speed high-density organic carriers; holey optochip design; holey transceiver IC; optical input-output; optical transceiver module; optical transceivers; optoelectronic arrays; parallel optical transceiver; photodiode arrays; receiver amplification circuitry; single-chip 4 RX optical module; single-chip 4 TX optical module; size 0.8 mm; size 850 nm; transmitter amplification circuitry; High-speed optical techniques; Integrated circuits; Integrated optics; Optical device fabrication; Optical receivers; Optical transmitters; Transceivers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
ISSN :
0569-5503
Print_ISBN :
978-1-4799-0233-0
Type :
conf
DOI :
10.1109/ECTC.2013.6575582
Filename :
6575582
Link To Document :
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