Title :
FPC-based compact 25-Gb/s optical transceiver module for optical interconnect utilizing novel high-speed FPC connector
Author :
Yagisawa, Takatoshi ; Shiraishi, Tomohiro ; Ikeuchi, T. ; Tanaka, Kiyoshi
Author_Institution :
Fujitsu Labs. Ltd., Kawasaki, Japan
Abstract :
A compact (22.6 × 9.1 × 0.86 mm), 25-Gb/s, flexible printed circuit based optical transceiver module was developed. The module consists of a 25-μm-thick FPC substrate on which a vertical-cavity surface-emitting laser array, driver, photodiode array, and a transimpedance amplifier are mounted by flip-chip bonding. The polymer waveguide is laminated from the backside of the FPC via microlens-imprinted film for the optical coupling. Its compactness and high-speed characteristics were realized by using a 0.35-mm-pitch novel FPC connector accurately designed by using a three-dimensional electromagnetic simulation. It was confirmed that the bandwidth of the FPC connector was more than 40 GHz. Also the measured results of the frequency response corresponded with the simulation results. Clear eye openings and error-free operation of all eight channels at 25 Gb/s were obtained with the fabricated optical transceiver.
Keywords :
flexible electronics; flip-chip devices; operational amplifiers; optical couplers; optical interconnections; optical transceivers; photodiodes; surface emitting lasers; FPC-based compact optical transceiver module; bit rate 25 Gbit/s; clear eye opening; error-free operation; flexible printed circuit based optical transceiver module; flip-chip bonding; frequency response; high-speed FPC connector; microlens-imprinted film; optical coupling; optical interconnection; photodiode array; polymer waveguide; size 0.35 mum; size 25 mum; size 45 mum; three-dimensional electromagnetic simulation; transimpedance amplifier; vertical-cavity surface-emitting laser array; Adaptive optics; Connectors; Electrodes; High-speed optical techniques; Optical device fabrication; Optical waveguides; Transmission line measurements;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4799-0233-0
DOI :
10.1109/ECTC.2013.6575583