• DocumentCode
    628472
  • Title

    The effect of coating thickness on the electrical performance of novel isotropic conductive adhesives prepared using metallised polymer micro-spheres

  • Author

    Jain, Sonal ; Whalley, David C. ; Cottrill, M. ; Helland, Tore ; Kristiansen, Helge ; Redford, K. ; Liu, Cong

  • Author_Institution
    Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., Loughborough, UK
  • fYear
    2013
  • fDate
    28-31 May 2013
  • Firstpage
    796
  • Lastpage
    802
  • Abstract
    Traditionally, isotropically conductive adhesives (ICAs) have been prepared using a high volume fraction of solid silver flakes and particles in a non-conducting adhesive matrix. However, this paper focuses on newly developed ICAs containing a large volume fraction of silver coated polymer spheres (Ag-PS) as the filler in a non-conductive adhesive matrix. This paper mainly investigates the effect of thickness/morphology of the silver coating on the electrical conductivity and percolation threshold of such ICAs. For this study 30μm polymer spheres with four different coating thicknesses have been used. B oth the percolation threshold and the resistivity for a given volume fraction have been found to decrease with increasing thickness of the Ag coating.
  • Keywords
    conductive adhesives; crystal morphology; metallisation; percolation; polymers; protective coatings; Ag; ICA; electrical conductivity; electrical performance; isotropic conductive adhesives; metallised polymer microspheres; nonconducting adhesive matrix; percolation threshold; silver coated polymer spheres; silver coating; size 30 mum; solid silver flakes; thickness-morphology; Coatings; Conductivity; Electrical resistance measurement; Polymers; Resistance; Silver;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4799-0233-0
  • Type

    conf

  • DOI
    10.1109/ECTC.2013.6575664
  • Filename
    6575664