Thermally enhanced pre-applied underfills for 3D integration

Author

Horibe, A. ; Okamoto, K. ; Mori, Hisamichi ; Orii, Y. ; Kawate, Kohichiro ; Takamatsu, Yusuke ; Akiyama, Hidenori

Author_Institution

IBM Res. - Tokyo, Kawasaki, Japan

fYear

2013

fDate

28-31 May 2013

Firstpage

909

Lastpage

914

Abstract

One of the biggest challenges for future high-performance three dimensional (3D) integrated devices is heat removal from the stacked dies. In this study, thermally enhanced pre-applied type underfills were studied. These materials were formulated considering fillet cracks and delaminations that appeared in thermal cycling tests on 2D organic package. Finally, the applicability for 3D integration processing with the new material was evaluated on a 3D test vehicle assembly.

Keywords

assembling; cracks; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; thermal management (packaging); three-dimensional integrated circuits; 2D organic package; 3D integration processing; 3D test vehicle assembly; delamination; fillet cracks; heat removal; high-performance three dimensional integrated devices; stacked dies; thermal cycling test; thermally enhanced preapplied type underfills; Assembly; Silicon; Substrates; Temperature measurement; Thermal conductivity; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd

Conference_Location

Las Vegas, NV

ISSN

0569-5503

Print_ISBN

978-1-4799-0233-0

Type

conf

DOI

10.1109/ECTC.2013.6575682

Filename

6575682