DocumentCode :
628517
Title :
Analysis of power integrity and its jitter impact in a 4.3Gbps low-power memory interface
Author :
Hai Lan ; Xinhai Jiang ; Jihong Ren
Author_Institution :
Rambus Inc., Sunnyvale, CA, USA
fYear :
2013
fDate :
28-31 May 2013
Firstpage :
1087
Lastpage :
1093
Abstract :
An innovated low-power memory interface with data rate up to 4.3Gbps presents unique challenges to power integrity (PI) design and verification. While benign to power saving, the employed low-power design techniques, such as power state management, low-power clocking circuit, and on-chip voltage regulator, make the interface more susceptible to supply noise, particularly, in terms of its jitter impact. A systematic approach of analyzing power supply noise induced jitter (PSIJ) at design stage is critical to ensure the robustness of such low-power interface. In this paper, the methodology and simulation results are presented in concert with the correlation data. It is shown that when in fully active state, the steady-state on-chip supply noise is 4mVpp and its PSIJ timing impact is 1.7%UI for the 4.3Gbps operation. However, during power state transition the transient supply noise deteriorates to more than 20mVpp and the corresponding PSIJ impact is as high as 11.3%UI.
Keywords :
integrated circuit design; integrated circuit noise; integrated circuit testing; integrated memory circuits; low-power electronics; power supply circuits; timing jitter; analyzing power supply noise induced jitter; bit rate 4.3 Gbit/s; jitter impact; low power clocking circuit; low power design technique; low power memory interface; on-chip voltage regulator; power integrity design; power integrity verification; power saving; power state management; timing impact; Clocks; Jitter; Noise; Regulators; Sensitivity; System-on-chip; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
ISSN :
0569-5503
Print_ISBN :
978-1-4799-0233-0
Type :
conf
DOI :
10.1109/ECTC.2013.6575709
Filename :
6575709
Link To Document :
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