The effect of corner glue on BGA package temperature cycling performance: A modeling study

It is well known that corner glue (CG) applied at the corner of BGA packages can mitigate shock and vibration risk in solder joints at the package corners. With certain materials, CG may improve solder joint temperature cycling performance. Based on finite element modeling studies, the effect of CG on package solder joint damage in temperature cycle testing is categorized into two aspects out of plane (OOP) deformation and shear deformation. Corner solder joint OOP deformation is related to the coefficient of thermal expansion (CTE) of the CG. CG also serves to reduce shear deformation in solder joints at package corners. Mechanical models with different complexities were analyzed to demonstrate these two effects.