Title :
Low cost BT organic material for wireless 60 GHz application
Author :
Talebbeydokhti, Pouya ; Megahed, Mohamed A.
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
Low cost organic materials have gained a lot of attention as a potential high-performance microwave substrate and packaging material. BT organic substrate has been the substrate of choice for electronics packaging during the last few decades. BT is an organic material that offers a unique, low-cost, all-in-one solution for high frequency designs due to its ability to act as a high-performance stable substrate for multilayer packaging. Many materials have been developed in the last few years, like Liquid Crystal Polymer (LCP) but suffer from many issues regarding high volume manufacturing for multi-layer structure. Because of these characteristics, BT is very appealing for many applications, and it can be viewed as a prime material for enabling system-on-package RF and millimeter wave designs. Commercial interest in millimeter wave frequencies has initiated a large scale, world-wide effort to develop systems requiring low cost HVM high-performance dielectric materials. Examples of this trend include 60 GHz Wi-Gig and wireless personal area network (WPAN) systems, ~77GHz automotive radar, and ~94GHz millimeter wave. This dictates the integration of Antenna with RFIC on the same module substrate posing numerous architecture challenges. This research uses several methods to determine the electrical properties of BT for mm-wave frequencies. Microstrip, Coplanar Waveguide, Stripline, Straight and Ring Resonators are measured in order to characterize the dielectric constant and loss tangent of the BT from 1 GHz to 65 GHz.
Keywords :
coplanar waveguides; dielectric materials; integrated circuit design; microstrip resonators; millimetre wave antennas; millimetre wave integrated circuits; millimetre wave resonators; system-on-package; BT electrical properties; BT organic substrate; LCP; RFIC; WPAN systems; Wi-Gig systems; antenna integration; automotive radar; coplanar waveguide; dielectric constant; electronics packaging; frequency 1 GHz to 65 GHz; frequency 77 GHz; frequency 94 GHz; high volume manufacturing; high-performance microwave packaging material; high-performance microwave substrate; high-performance stable substrate; liquid crystal polymer; low cost BT organic material; low cost HVM high-performance dielectric materials; microstrip resonators; multilayer packaging; multilayer structure; ring resonators; straight resonators; stripline; system-on-package RF designs; system-on-package millimeter wave designs; wireless application; wireless personal area network systems; Dielectric measurement; Laminates; Microstrip; Resonant frequency; Substrates; Transmission line measurements;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4799-0233-0
DOI :
10.1109/ECTC.2013.6575791