• DocumentCode
    628620
  • Title

    Nonlinear viscoelastic constitutive model for organic laminate substrate

  • Author

    Tz-Cheng Chiu ; Yao-Yu Chan ; Yi-Shao Lai

  • Author_Institution
    Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2013
  • fDate
    28-31 May 2013
  • Firstpage
    1759
  • Lastpage
    1766
  • Abstract
    Organic laminate substrate is one of the largest constituent volume-wise in area array packages, and it plays a key role in overall package stress and warpage evolutions during fabrication process and in service conditions. In order to accurately estimate the influences of substrate on stress and warpage, it is important to characterize the time-dependent constitutive behavior of the organic substrate. In this study, a series of tensile creep and creep recovery experiments were performed to characterize the time-dependent behavior of a single-core laminate substrate. Nonlinear viscoelastic constitutive models including the Schapery model and a time-temperature-stress superposition model were developed based on the experimental characterization, and applied to simulate strain responses under cyclic loading conditions. It is shown that the predictions based on the nonlinear viscoelastic models give more accurate estimations on strain responses to creep and creep recovery loadings than the linear viscoelastic model does, in particularly for stress levels higher than 30% of the substrate´s fracture strength.
  • Keywords
    ball grid arrays; creep; fracture toughness; laminates; tensile strength; viscoelasticity; Schapery model; area array package; creep recovery; cyclic loading; fracture strength; nonlinear viscoelastic constitutive model; organic laminate substrate; package stress; single-core laminate substrate; strain response; stress level; tensile creep; time-dependent constitutive behavior; time-temperature-stress superposition model; warpage evolution; Creep; Laminates; Load modeling; Mathematical model; Strain; Stress; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4799-0233-0
  • Type

    conf

  • DOI
    10.1109/ECTC.2013.6575813
  • Filename
    6575813