Title :
Ethylene-Vinyl Acetate as a low cost encapsulant for hybrid electronic and fluidic circuits
Author :
Babikian, Sarkis ; Cox-Muranami, Wesley A. ; Nelson, Edward ; Li, G.P. ; Bachman, Mark
Author_Institution :
Univ. of California, Irvine, Irvine, CA, USA
Abstract :
We have developed a novel process that uses Ethylene-Vinyl Acetate (EVA) films to realize low cost integrated microfluidic systems in small packages. The EVA acts as both a final package for the device as well as a functional material for hosting molded microfluidic channels and optical structures such as waveguides. In this paper we describe the lamination based packaging of microfluidics, characterize the adhesion strength between layers of the device and investigate the biocompatibility of EVA for microfluidic applications.
Keywords :
adhesion; carbon compounds; electronics packaging; laminations; microfluidics; moulding; EVA biocompatibility; EVA films; adhesion strength; ethylene-vinyl acetate; fluidic circuits; functional material; hybrid electronic circuits; integrated microfluidic systems; lamination-based packaging; microfluidic applications; molded microfluidic channels hosting; optical structures; Adhesives; Cells (biology); Films; Microfluidics; Packaging; Substrates;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4799-0233-0
DOI :
10.1109/ECTC.2013.6575820
