Ethylene-Vinyl Acetate as a low cost encapsulant for hybrid electronic and fluidic circuits

Author

Babikian, Sarkis ; Cox-Muranami, Wesley A. ; Nelson, Edward ; Li, G.P. ; Bachman, Mark

Author_Institution

Univ. of California, Irvine, Irvine, CA, USA

fYear

2013

fDate

28-31 May 2013

Firstpage

1800

Lastpage

1805

Abstract

We have developed a novel process that uses Ethylene-Vinyl Acetate (EVA) films to realize low cost integrated microfluidic systems in small packages. The EVA acts as both a final package for the device as well as a functional material for hosting molded microfluidic channels and optical structures such as waveguides. In this paper we describe the lamination based packaging of microfluidics, characterize the adhesion strength between layers of the device and investigate the biocompatibility of EVA for microfluidic applications.

Keywords

adhesion; carbon compounds; electronics packaging; laminations; microfluidics; moulding; EVA biocompatibility; EVA films; adhesion strength; ethylene-vinyl acetate; fluidic circuits; functional material; hybrid electronic circuits; integrated microfluidic systems; lamination-based packaging; microfluidic applications; molded microfluidic channels hosting; optical structures; Adhesives; Cells (biology); Films; Microfluidics; Packaging; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd

Conference_Location

Las Vegas, NV

ISSN

0569-5503

Print_ISBN

978-1-4799-0233-0

Type

conf

DOI

10.1109/ECTC.2013.6575820

Filename

6575820