Noise coupling of through-via in silicon and glass interposer

The noise coupling between signal through-vias of silicon-based interposer and glass-based interposer are compared by simulating in both frequency and time domain. In addition to noise coupling, through-via´s S₂₁ in both interposers is also simulated and compared. To obtain reasonable data, all dimension parameters are chosen based on existing recent technology and material properties are also chosen based on further chip manufacturing. With these simulations, it is observed that the glass interposer shows better noise blocking performance, and some important features between silicon and glass interposer are qualitatively explained through previous through-via model.