Title :
Wafer-level integration of micro-lens for THz focal plane array application
Author :
Kyoung Youl Park ; Wiwatcharagoses, Nophadon ; Chahal, Premjeet
Author_Institution :
Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
Abstract :
Design and fabrication of dielectric lenses for terahertz (THz) focal plane arrays are presented in this paper. Lenses are designed using optical lens and ellipsoid function theory in the terahertz range (centered at f = 300GHz). In order to enhance coupling to planar circuits on wafer, two types of lenses are considered: modified hemispherical, such as extended hemispherical and hypo-hemispherical. Full wave analysis of the lens design is carried out both in near- and far-field regimes. The lenses are fabricated using a 3D plastic printer. An approach to use the 3D printed structure as a mold to fabricate micro-injection molded lenses is also introduced. Measured results on 3D printed lens array show high transmission characteristics and measured results correlate closely with simulation results.
Keywords :
dielectric materials; focal planes; microlenses; terahertz wave devices; three-dimensional printing; wafer level packaging; wafer-scale integration; 3D plastic printer; 3D printed lens array; dielectric lenses; ellipsoid function theory; extended hemispherical lens; far-field regimes; frequency 300 GHz; full wave analysis; hypo-hemispherical lens; microinjection molded lenses; modified hemispherical lens; near-field regimes; optical lens; planar circuits; terahertz focal plane arrays; Apertures; Arrays; Detectors; Dielectrics; Fabrication; Lenses; Materials;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4799-0233-0
DOI :
10.1109/ECTC.2013.6575839