DocumentCode :
628663
Title :
3D Antenna for GHz application and vibration energy harvesting
Author :
Kholostov, K. ; Nenzi, P. ; Palma, Francis ; Balucani, Marco
Author_Institution :
DIET, Univ. of Rome “La Sapienza”, Rome, Italy
fYear :
2013
fDate :
28-31 May 2013
Firstpage :
2018
Lastpage :
2023
Abstract :
In this work we present a new design for a three-dimensional vibration energy harvester, which is made by Micro-Electro-Mechanical Systems (MEMS) technology, and which can convert electric energy through transverse mode piezoelectric effect. The presented power generator is based on a long, thick-film, piezoelectric beam configured as a conical helix structure and located between two metal electrodes. The design of the combined antenna/energy harvester (comvester, from communication and energy harvester) device addresses both electromagnetic and mechanical issues as it radiates electromagnetic energy and converts mechanical energy into electric energy. Both functions are translated directly into dimensional constraints of the structure. In this work, we concentrate on millimeter waves communications in the 60 GHz frequency band because of their availability for low-power CMOS radio circuits. In order to realize comvester on a silicon wafer we used Controlled Release Metal Layer (CRML) technology, which is a transfer layer technology that uses porous silicon as sacrificial material. The advantage of CRML technology is high repeatability and resolution and its compatibility with back-end of line processes of the integrated circuit industry. New type of piezoelectric material consisted of the array of separated vertical polyvinylidene fluoride (PVDF) microrods is suggested. Such periodic microrods structure became possible to realize using the template of the structured macroporous silicon.
Keywords :
energy harvesting; microhardness; micromechanical devices; 3D antenna; 3D vibration energy harvester; CRML technology; MEMS technology; PVDF microrods; antenna/energy harvester; comvester; conical helix structure; controlled release metal layer technology; electric energy; electromagnetic energy; integrated circuit industry; low power CMOS radio circuits; mechanical energy; metal electrodes; microelectromechanical systems; millimeter waves communications; periodic microrods structure; piezoelectric beam; piezoelectric material; polyvinylidene fluoride; power generator; silicon wafer; structured macroporous silicon; transfer layer technology; transverse mode piezoelectric effect; vibration energy harvesting; Helical antennas; Metals; Micromechanical devices; Silicon; Substrates; Vibrations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
ISSN :
0569-5503
Print_ISBN :
978-1-4799-0233-0
Type :
conf
DOI :
10.1109/ECTC.2013.6575856
Filename :
6575856
Link To Document :
بازگشت