Title :
Graphene heat spreader for thermal management of hot spots
Author :
Zhaoli Gao ; Yong Zhang ; Yifeng Fu ; Yuen, Michelle ; Liu, Jiangchuan
Author_Institution :
Dept. of Microtechnol. & Nanosci., Chalmers Univ. of Technol., Gothenburg, Sweden
Abstract :
Monolayer graphene was fabricated using thermal chemical vapor deposition (TCVD) as heat spreaders in electronic packaging. Platinum (Pt) thermal evaluation chips were utilized to evaluate the thermal performance of the graphene heat spreaders. Temperature of hot spot driven at a heat flux of up to 430W·cm-2 was decreased by about 13 °C with the attaching of the graphene heat spreader. We demonstrate the potentials of using CMOS compatible TCVD process to make graphene as heat spreader for power dissipation needs.
Keywords :
chemical vapour deposition; graphene; thermal management (packaging); CMOS compatible TCVD process; electronic packaging; graphene heat spreader; heat flux; heat spreaders; hot spots; monolayer graphene; platinum thermal evaluation chips; power dissipation; thermal chemical vapor deposition; thermal management; thermal performance; Electronic packaging thermal management; Graphene; Heating; Materials; Resistance; Temperature measurement; Thermal management;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4799-0233-0
DOI :
10.1109/ECTC.2013.6575865
