DocumentCode :
628690
Title :
Understanding loss mechanisms of passive interconnects with innovative/cost effective structure implementations for supporting 28Gbps and beyond transmission
Author :
Namhoon Kim ; Joong-Ho Kim ; Anderson, Richard ; Wu, Po-Han ; Ramalingam, S.
Author_Institution :
Xilinx, Inc., San Jose, CA, USA
fYear :
2013
fDate :
28-31 May 2013
Firstpage :
2179
Lastpage :
2182
Abstract :
Channel loss budgets are becoming more stringent as operating speeds increase. The loss mechanisms of these high-speed channels need to be properly understood in order to minimize the channel loss. The conductor loss, including skin effect loss and surface roughness loss as well as dielectric loss will be addressed theoretically and practically in various cases. This paper will study and identify which losses are primarily responsible for determining system performance in various cases.
Keywords :
dielectric losses; electronics packaging; surface roughness; bit rate 28 Gbit/s; channel loss budgets; dielectric loss; innovative/cost effective structure; loss mechanisms; passive interconnects; skin effect loss; surface roughness loss; Conductors; Dielectric losses; Rough surfaces; Substrates; Surface impedance; Surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
ISSN :
0569-5503
Print_ISBN :
978-1-4799-0233-0
Type :
conf
DOI :
10.1109/ECTC.2013.6575883
Filename :
6575883
Link To Document :
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