Assembly level digital image correlation under reflow and thermal cycling conditions

Digital image correlation is an attractive displacement measurement method for thermo-mechanical characterization and simulation of electronic assemblies, but faces a number of challenges to implementation. In this paper, a batch reflow oven with a large window was used to allow for optical measurements, and hardware modifications and test methods were developed to enable successful data acquisition under both reflow and thermal cycling conditions. The modified hardware setup is detailed, test methods are presented, and two examples of successful experiments are demonstrated.