Post assembly warpage prediction using refined zigzag element

Excessive warpage is one of the major concerns as the electronics industry is producing increasingly thinner dies and substrates; thus, requiring maximum dimensional stability. Consequently, a predictive capability for reducing warpage in is essential as part of the electronic device design process. In order to understand and identify the significant parameters causing excessive warpage, this study presents an approach based on finite element analysis using the refined zigzag element without requiring discretization in the thickness direction. However, it explicitly models the sequence of lamination that accounts for the topology of each layer in the substrate and its individual material properties.