DocumentCode :
628704
Title :
Atomistic study of welding of carbon nanotube onto metallic substrates
Author :
Xiaohui Song ; Mingxiang Chen ; Zhiyin Gan
Author_Institution :
Wuhan Nat. Lab. for Optoelectron., Wuhan, China
fYear :
2013
fDate :
28-31 May 2013
Firstpage :
2259
Lastpage :
2263
Abstract :
Mechanism of carbon nanotube bonding onto the metal substrate is investigated using molecular dynamics in this study. Different temperatures and types of the metal atoms to the carbon nanotube surface are considered. It is shown that there is close relationship between surface melting and contact length of the bonding. The melting firstly occurs on the surface of the metal and the contact length increases with the melting propagating from the open surface to the interior of the metal as the temperature rising. In addition, the wetting property of the metal atoms plays an important role during the bonding of the carbon nanotube onto the metal. The carbon nanotube will be easily welded onto the metal with excellent wetting property. The results indicate that the bonding process of the carbon nanotube onto the metal can be controlled by two ways. First, concentrating energy on the metal surface to enhance the surface melting. Second, selecting the metal with excellent wetting property or effective method is utilized to enhance the wetting property of the metal atoms to the carbon nanotube surface.
Keywords :
bonding processes; carbon nanotubes; melting; molecular dynamics method; temperature; welding; wetting; atomistic study; bonding process; carbon nanotube bonding; carbon nanotube surface; contact length; metal atoms; metal surface; metallic substrates; molecular dynamics; open surface; surface melting; temperature rising; temperatures; welding; wetting property; Atomic layer deposition; Carbon nanotubes; Nickel; Surface treatment; Temperature; Welding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
ISSN :
0569-5503
Print_ISBN :
978-1-4799-0233-0
Type :
conf
DOI :
10.1109/ECTC.2013.6575897
Filename :
6575897
Link To Document :
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