Title :
Packaging and sensing platform using opto-electronic zinc oxide nano-heterostructure integration
Author :
Gupta, Arpan ; Spryn, Mitchell ; Kim, Bumki ; Edwards, E. ; Brantley, Christina ; Ruffin, Paul
Author_Institution :
Univ. of Alabama, Tuscaloosa, AL, USA
Abstract :
In this work we report the sensing behavior of zinc oxide/pyrenebutyric acid nano-heterostructure and subsequent packaging of the sensor. High quality zinc oxide nanowires were synthesized and appropriately characterized. Surface of zinc oxide nanowires were engineered with optically active pyrenebutyric acid. Time dependent fluorescence quenching of the nano-heterostructure was utilized as a means to establish sensing behavior in presence of p-nitrophenol analyte. Furthermore, electrical characterization of pristine and surface-engineered zinc oxide nanowire chip is also reported. Based on these findings it was determined that the synthesized nano-heterostructure was capable of sensitive detection of p-nitrophenol vapor under ambient conditions. However, successful operation and reliable data is critically dependent on the analog sensor circuit design and subsequent packaging. Herein, we demonstrate a packaging strategy for integrating the sensing chip into a complete platform. Challenges with system integration are highlighted and a possible packaging approach for high sensitivity detection is outlined.
Keywords :
II-VI semiconductors; electronics packaging; gas sensors; integrated optoelectronics; nanosensors; nanowires; radiation quenching; spectrochemical analysis; zinc compounds; ZnO; electrical characterization; optically active pyrenebutyric acid; opto-electronic nanoheterostructure integration; p-nitrophenol analyte; p-nitrophenol vapor; packaging platform; pristine nanowire chip; sensing chip; sensing platform; surface engineered nanowire chip; time dependent fluorescence quenching; Fluorescence; Nanowires; Optical sensors; Packaging; Sensitivity; Zinc oxide;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4799-0233-0
DOI :
10.1109/ECTC.2013.6575899