A small flat-plate vapor chamber fabricated by copper powder sintering and diffusion bonding for cooling electronic packages

In this paper, a small flat-plate vapor chamber was developed to solve hotspot issue in high power electronic packages. The flat-plate vapor chamber was sealed by diffusion bonding technology and its porous wicks were fabricated by sintering copper powder. The transient and steady temperature distributions of the flat plate vapor chamber were experimentally measured. Its performance was compared with a copper spreader plate with the same dimensions under the same conditions. The dependence of the thermal resistance of the vapor chamber on the incline angle was also investigated. When the heat transfer rate was 22.1W, the bulk thermal resistance was as low as 0.01°C/W, and the spreading thermal resistance was less than 0.30°C/W. The results illustrate that the present vapor chamber can realize low thermal resistance and achieve good temperature uniformity.