DocumentCode :
628712
Title :
D-Band characterization of co-planar wave guide and microstrip transmission lines on liquid crystal polymer
Author :
Khan, Wasif T. ; Ulusoy, A. Cagri ; Papapolymerou, John
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2013
fDate :
28-31 May 2013
Firstpage :
2304
Lastpage :
2309
Abstract :
In this paper, for the first time, characterization of planar transmission lines on organic Liquid Crystal Polymer (LCP) substrate in D-Band is presented. Via-less conductor backed co-planar wave guide (CB-CPW) and microstrip lines are designed, fabricated and measured on 2 mil organic LCP substrate. Line-reflect-reflect-match (LRRM) calibration technique was used to measure the fabricated lines, whereas in order to accurately extract line loss and to characterize the substrate, a thru-reflect-line (TRL) calibration was performed. The results have shown excellent RF performance of LCP in the D-band, while the microstrip line exhibits a loss of 0.1755 dB/mm at 110 GHz, with a monotonous increase to 0.331dB/mm at 170 GHz. An almost constant (~2.6) effective dielectric constant is also reported within the whole measurement band.
Keywords :
calibration; coplanar transmission lines; coplanar waveguides; liquid crystal polymers; microstrip lines; permittivity; CB-CPW; D-band characterization; LRRM calibration technique; RF performance; TRL calibration; dielectric constant; fabricated lines; frequency 110 GHz; frequency 170 GHz; line-reflect-reflect-match calibration technique; measurement band; microstrip lines; microstrip transmission lines; organic LCP substrate; organic liquid crystal polymer substrate; planar transmission lines; thru-reflect-line calibration; via-less conductor backed coplanar wave guide; Calibration; Coplanar waveguides; Dielectric measurement; Loss measurement; Microstrip; Substrates; Transmission line measurements;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location :
Las Vegas, NV
ISSN :
0569-5503
Print_ISBN :
978-1-4799-0233-0
Type :
conf
DOI :
10.1109/ECTC.2013.6575905
Filename :
6575905
Link To Document :
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