Stretchable/printed RF devices via high-throughput, high-definability soft-lithography fabrication

In this paper, we introduce a novel method to fabricate stretchable RF devices in a high-throughput, high definability manner. Silicone with high elasticity and high hardness is used as both a dielectric substrate and a mold to replicate the pattern from silicon by soft-lithography. A silicone based electrically conductive adhesive (ECA) is used as the conducting material because of its low electrical resistivity (1.6×10^-4 Ω.cm) and high elasticity (>500% elongation at break). This novel method is used to fabricate two antennas with different dimensions. The antenna has a high efficiency (|S₁₁|> 30%) and the resonance can be tuned to desirable values according to the applied strain.