Title :
A one week-lecture in the Euro-dots course program: Microelectronic assemblies: From packaging to reliability
Author :
Debeda, Helene ; Favre, Isabelle ; Gracia, Alexandrine ; Labat, N. ; Plano, B. ; Fremont, H.
Author_Institution :
Lab. IMS, Univ. de Bordeaux, Talence, France
Abstract :
The course “Microelectronic assemblies: from packaging to reliability” is a one-week-course module within the Euro-dots program proposed at the IMS Laboratory, University Bordeaux, with lectures illustrated by labs. It takes benefits from expertise of different teachers and research teams and also technological, failure analysis and characterization platforms.
Keywords :
electronics packaging; failure analysis; microassembling; reliability; Euro-dots course program; IMS Laboratory; University Bordeaux; eliability; failure analysis; microelectronic assemblies; packaging; Assembly; Failure analysis; Materials; Microelectronics; Packaging; Reliability; Wires; COB; SMT; failure; high level lecture; microelectronic assembly; packaging; reflow; reliability; solder; wire-bonding;
Conference_Titel :
EAEEIE Annual Conference (EAEEIE), 2013 Proceedings of the 24th
Conference_Location :
Chania
Print_ISBN :
978-1-4799-0042-8
DOI :
10.1109/EAEEIE.2013.6576514
