3D IC heterogeneous integration of GPS RF receiver, baseband, and DRAM on CoWoS with system BIST solution

Author

Liao, W.S. ; Chen, H.N. ; Yen, K.K. ; Yeh, E.H. ; Kuo, F.W. ; Yeh, T.J. ; Kuo, Fei-Ching ; Jou, C.P. ; Liu, Siyuan ; Hsueh, F.L. ; Lin, H.C. ; Peng, C.N. ; Wang, Maximilian J. ; Wu, W.C. ; Hu, S.P. ; Chen, Mayee F. ; Hou, S.Y. ; Jeng, S.P. ; Yu, Cody Hao

Author_Institution

R&D, Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan

fYear

2013

fDate

11-13 June 2013

Abstract

A 3D IC heterogeneous chip integration of 65nm RF receiver, 28nm baseband processor, and 40nm DRAM on a proprietary CoWoS structure is demonstrated and its electrical characterization of KGS (Known Good Stack) has revealed a highly comparable system performance as compared to that of the KGD (Known Good Die) testing data. Moreover, an innovative system BIST (Built-in-Self-Test) scheme and methodology have been designed to save screening time by over 90% as compared to that of the conventional ATE full functional test. This work also exhibits an emerging application possibility for all other CoWoS related system integration such as smart mobile devices, smart consumer electronics, remote medical diagnosis and smart car telemetry, etc.

Keywords

DRAM chips; Global Positioning System; built-in self test; radio receivers; three-dimensional integrated circuits; 3D IC heterogeneous integration; ATE; BIST; DRAM; GPS RF receiver; baseband processor; built-in-self-test; known good die; known good stack; remote medical diagnosis; size 28 nm; size 65 nm; smart car telemetry; smart consumer electronics; smart mobile devices; Baseband; Built-in self-test; Global Positioning System; Radio frequency; Random access memory; Receivers; 3D IC; Baseband; CoWoS; DRAM and BIST; GPS;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology (VLSIT), 2013 Symposium on

Conference_Location

Kyoto

ISSN

0743-1562

Print_ISBN

978-1-4673-5226-0

Type

conf

Filename

6576606