DocumentCode
629167
Title
System design considerations for next generation wireless mobile devices
Author
Gilmore, Rob
Author_Institution
Qualcomm Technol., Inc., San Diego, CA, USA
fYear
2013
fDate
11-13 June 2013
Abstract
During the last few years there has been an explosive growth in demand for smartphones with increasing capabilities and performance. With this demand come many associated hardware challenges. Power consumption is perhaps the foremost challenge. There are ever-increasing processing power requirements and an increasing number of computer cores. Many of the new capabilities require that some circuitry be “always-on” and “always-aware.” Higher data rates demand wider bandwidth baseband circuits, faster Digital Signal Processor (DSP) engines and increased peak-to-average ratios of the transmitted waveforms. Increased system capacity and global demand require an increasing number of frequency bands. This leads to a proportional increase in the overall RF front-end size and cost. Achieving the system capacity needed in the future will require dense deployment of femtocells to distribute traffic close to the user terminals. There will be an increased use of higher frequencies which will require >5 GHz design, modeling, packaging and test.
Keywords
digital signal processing chips; femtocellular radio; next generation networks; power consumption; radio equipment; smart phones; telecommunication traffic; DSP engines; RF front-end size; always-aware circuitry; always-on circuitry; bandwidth baseband circuits; computer cores; digital signal processor engines; next generation wireless mobile devices; power consumption; power requirements; smartphones; system capacity; traffic distribution; user terminals; Batteries; Femtocells; Hardware; MIMO; Mobile communication; Performance evaluation; Smart phones; 1000x; always-on always-aware; band combinations; battery technology; co-existence; context aware; femtocell; heterogeneous processing; hetnet; low power; mobile antennas; mobile capacity; mobile platform; mobile power amplifier; monolithic 3d; multi-core; situation awareness; smartphone;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology (VLSIT), 2013 Symposium on
Conference_Location
Kyoto
ISSN
0743-1562
Print_ISBN
978-1-4673-5226-0
Type
conf
Filename
6576666
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