Low-power design based on ODTM technique

Power optimization be a pressure raised issues on circuits designers, circuits making of manufacture section, because circuit optimization make some significant and serial problems like reduced circuit´s speed, power, efficiency, performance, damages, runtime exceeds and lifetime degraded with increasing clock time. Thermal and power delivery issues are becoming especially critical for high performance computing systems. Most important of this drawback of those problems should be conclusion with further more technical development of circuit design of new optimized circuits, namely as Optimized dynamic thermal management (ODTM) technique. If a particular workload operates above this point for sustained periods, a ODTM response will work to reduce chip temperature. In essence, ODTM allows designers to focus on average, rather than worst-case, thermal conditions in their designs. ODTM allows packaging engineers to design systems for a target sustained thermal value that is much closer to average-case for real benchmarks. Experimental results on bench marks show that the proposed technique can improve the gate replacement leakage optimization by 18-30%.