• DocumentCode
    630256
  • Title

    Evaluation of control methods for isolated three-phase AC-DC converter using modular multilevel converter topology

  • Author

    Nakanishi, Tetsuya ; Itoh, Jun-ichi

  • Author_Institution
    Dept. of Electr., Electron. & Inf. Eng., Nagaoka Univ. of Technol., Nagaoka, Japan
  • fYear
    2013
  • fDate
    3-6 June 2013
  • Firstpage
    52
  • Lastpage
    58
  • Abstract
    This paper discusses a novel isolated three-phase AC-DC converter using Modular Multi-level Converter (MMC) topology for a medium voltage application. The MMC at a primary stage of an isolated AC-DC converter can directly convert a three-phase AC into a high-frequency AC voltage of 1 kHz. In this paper, the features of the proposed circuit are discussed according to the voltage ratings of the switching devices. Moreover, the total harmonic distortion (THD) of the input current, the output voltage, the number of cells and the capacitance of the DC capacitor are evaluated on each switching devices in the proposed system. Finally, the proposed system performance with SiC MOSFET of 3.3 kV is demonstrated by the simulation. As a result, the proposed converter achieves the low THD of the input current waveform which is approximately 2.64%.
  • Keywords
    AC-DC power convertors; harmonic distortion; power MOSFET; power capacitors; silicon compounds; wide band gap semiconductors; DC capacitor; MMC topology; THD; current waveform; frequency 1 kHz; high-frequency AC voltage; isolated three-phase AC-DC converter; medium-voltage application; modular multilevel converter topology; silicon carbide MOSFET; switching device voltage rating; three-phase AC voltage; total harmonic distortion; voltage 3.3 kV; AC-DC power converters; Performance evaluation; Silicon carbide; Switches; Capacitor Voltage Control; Direct Power Conversion; H-bridge Cell; Isolated Three-phase AC-DC converter; Modular Multi-level converter;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ECCE Asia Downunder (ECCE Asia), 2013 IEEE
  • Conference_Location
    Melbourne, VIC
  • Print_ISBN
    978-1-4799-0483-9
  • Type

    conf

  • DOI
    10.1109/ECCE-Asia.2013.6579073
  • Filename
    6579073