DocumentCode :
630935
Title :
Storage-enhanced thermal management for mobile devices
Author :
Siyun Wang ; Baldea, Michael
Author_Institution :
McKetta Dept. of Chem. Eng., Univ. of Texas at Austin, Austin, TX, USA
fYear :
2013
fDate :
17-19 June 2013
Firstpage :
5344
Lastpage :
5349
Abstract :
During regular use, mobile devices generate significant amounts of heat. In this paper, we discuss the use of phase-change materials (PCM) as an energy storage medium to lower the energy consumption of temperature control devices in mobile systems. We adopt a systems perspective and show that the fundamental effect of latent-heat storage is to increase the time constant of the response of the system to changes in heat input without affecting the gain. We also demonstrate that PCM-based cooling reduces energy consumption when used in conjunction with active cooling in a hierarchical control structure, and establish a connection between the dynamics of the integrated system, energy savings and the quantity and geometric properties of the PCM elements. Composite heat sinks consisting of PCM elements confined in a matrix material with high thermal conductivity represent a promising practical implementation of PCM-based cooling. Using a first-principles model and a novel algorithm, we present a method for optimizing the size and number of the PCM elements in the matrix, which effectively amounts to “tuning” the PCM-based controller. We study the PCM-enhanced thermal management of a computer microchip to illustrate the theoretical concepts.
Keywords :
cooling; energy consumption; heat sinks; latent heat; mobile handsets; phase change materials; temperature control; thermal conductivity; thermal energy storage; thermal management (packaging); PCM elements; PCM-based controller; PCM-based cooling; PCM-enhanced thermal management; composite heat sinks; computer microchip; energy consumption; energy savings; energy storage medium; geometric properties; latent-heat storage; mobile devices; phase-change materials; storage-enhanced thermal management; temperature control devices; thermal conductivity; tuning; Heat sinks; Heat transfer; Heating; Phase change materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
American Control Conference (ACC), 2013
Conference_Location :
Washington, DC
ISSN :
0743-1619
Print_ISBN :
978-1-4799-0177-7
Type :
conf
DOI :
10.1109/ACC.2013.6580672
Filename :
6580672
Link To Document :
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