• DocumentCode
    630935
  • Title

    Storage-enhanced thermal management for mobile devices

  • Author

    Siyun Wang ; Baldea, Michael

  • Author_Institution
    McKetta Dept. of Chem. Eng., Univ. of Texas at Austin, Austin, TX, USA
  • fYear
    2013
  • fDate
    17-19 June 2013
  • Firstpage
    5344
  • Lastpage
    5349
  • Abstract
    During regular use, mobile devices generate significant amounts of heat. In this paper, we discuss the use of phase-change materials (PCM) as an energy storage medium to lower the energy consumption of temperature control devices in mobile systems. We adopt a systems perspective and show that the fundamental effect of latent-heat storage is to increase the time constant of the response of the system to changes in heat input without affecting the gain. We also demonstrate that PCM-based cooling reduces energy consumption when used in conjunction with active cooling in a hierarchical control structure, and establish a connection between the dynamics of the integrated system, energy savings and the quantity and geometric properties of the PCM elements. Composite heat sinks consisting of PCM elements confined in a matrix material with high thermal conductivity represent a promising practical implementation of PCM-based cooling. Using a first-principles model and a novel algorithm, we present a method for optimizing the size and number of the PCM elements in the matrix, which effectively amounts to “tuning” the PCM-based controller. We study the PCM-enhanced thermal management of a computer microchip to illustrate the theoretical concepts.
  • Keywords
    cooling; energy consumption; heat sinks; latent heat; mobile handsets; phase change materials; temperature control; thermal conductivity; thermal energy storage; thermal management (packaging); PCM elements; PCM-based controller; PCM-based cooling; PCM-enhanced thermal management; composite heat sinks; computer microchip; energy consumption; energy savings; energy storage medium; geometric properties; latent-heat storage; mobile devices; phase-change materials; storage-enhanced thermal management; temperature control devices; thermal conductivity; tuning; Heat sinks; Heat transfer; Heating; Phase change materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    American Control Conference (ACC), 2013
  • Conference_Location
    Washington, DC
  • ISSN
    0743-1619
  • Print_ISBN
    978-1-4799-0177-7
  • Type

    conf

  • DOI
    10.1109/ACC.2013.6580672
  • Filename
    6580672