DocumentCode
631492
Title
MRAM with soft reference layer: In-stack combination of memory and logic functions
Author
Stainer, Q. ; Lombard, L. ; Mackay, Ken ; Sousa, Ricardo C. ; Prejbeanu, Ioan L. ; Dieny, Bernard
Author_Institution
Crocus Technol., Grenoble, France
fYear
2013
fDate
26-29 May 2013
Firstpage
84
Lastpage
87
Abstract
This paper describes an original concept of thermally assisted MRAM in which memory and logic functions are combined in the same stack. The memory cell is represented by a magnetic tunnel junction having an exchange biased storage layer and a soft reference layer (called sense layer), replacing the conventional pinned reference layer. The write of the storage layer is ensured by a combination of heating pulses and magnetic stray fields created by the soft reference layer. The read is performed in a self-referenced manner by measuring the resistance variation associated to a field variation. This makes these memories much more tolerant to cell to cell variability. In addition, this stack intrinsically performs both a storage function and a comparison (XOR) function. This device called a Magnetic Logic Unit (MLU™) is particularly suited for security applications and Content Addressable Memories.
Keywords
MRAM devices; content-addressable storage; heating; magnetic logic; magnetic tunnelling; security; MLU; XOR function; cell to cell variability; comparison function; content addressable memory; exchange biased storage layer; heating pulse; in-stack combination; logic function; magnetic logic unit; magnetic stray field; magnetic tunnel junction; memory function; resistance variation measurement; security application; sense layer; soft reference layer; storage function; thermally assisted MRAM; Heating; Magnetic tunneling; Magnetization; Magnetostatics; Resistance; Switches; Writing; Field-induced switching; MRAM; Self-reference; Thermally Assisted Writing;
fLanguage
English
Publisher
ieee
Conference_Titel
Memory Workshop (IMW), 2013 5th IEEE International
Conference_Location
Monterey, CA
Print_ISBN
978-1-4673-6168-2
Type
conf
DOI
10.1109/IMW.2013.6582104
Filename
6582104
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