• DocumentCode
    631492
  • Title

    MRAM with soft reference layer: In-stack combination of memory and logic functions

  • Author

    Stainer, Q. ; Lombard, L. ; Mackay, Ken ; Sousa, Ricardo C. ; Prejbeanu, Ioan L. ; Dieny, Bernard

  • Author_Institution
    Crocus Technol., Grenoble, France
  • fYear
    2013
  • fDate
    26-29 May 2013
  • Firstpage
    84
  • Lastpage
    87
  • Abstract
    This paper describes an original concept of thermally assisted MRAM in which memory and logic functions are combined in the same stack. The memory cell is represented by a magnetic tunnel junction having an exchange biased storage layer and a soft reference layer (called sense layer), replacing the conventional pinned reference layer. The write of the storage layer is ensured by a combination of heating pulses and magnetic stray fields created by the soft reference layer. The read is performed in a self-referenced manner by measuring the resistance variation associated to a field variation. This makes these memories much more tolerant to cell to cell variability. In addition, this stack intrinsically performs both a storage function and a comparison (XOR) function. This device called a Magnetic Logic Unit (MLU™) is particularly suited for security applications and Content Addressable Memories.
  • Keywords
    MRAM devices; content-addressable storage; heating; magnetic logic; magnetic tunnelling; security; MLU; XOR function; cell to cell variability; comparison function; content addressable memory; exchange biased storage layer; heating pulse; in-stack combination; logic function; magnetic logic unit; magnetic stray field; magnetic tunnel junction; memory function; resistance variation measurement; security application; sense layer; soft reference layer; storage function; thermally assisted MRAM; Heating; Magnetic tunneling; Magnetization; Magnetostatics; Resistance; Switches; Writing; Field-induced switching; MRAM; Self-reference; Thermally Assisted Writing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Workshop (IMW), 2013 5th IEEE International
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    978-1-4673-6168-2
  • Type

    conf

  • DOI
    10.1109/IMW.2013.6582104
  • Filename
    6582104