• DocumentCode
    63191
  • Title

    Exploiting Implicit Information From Data for Linear Macromodeling

  • Author

    Chi-Un Lei

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China
  • Volume
    3
  • Issue
    9
  • fYear
    2013
  • fDate
    Sept. 2013
  • Firstpage
    1570
  • Lastpage
    1577
  • Abstract
    In macromodeling, data points of sampled structure responses are always matched to construct linear macromodels for transient simulations of packaging structures. However, implicit information from sampled data has not been exploited comprehensively to facilitate the identification process. In this paper, we exploit implicit information from the sampled data for linear marcomodeling. First, in order to include complementary data for a more informative identification, we propose a discrete-time domain identification framework for frequency-/time-/hybrid-domain macromodeling. Second, we introduce pre-/post-processing techniques (e.g., P-norm identification criterion and warped frequency-/hybrid-domain identification) to interpret implicit information for configurations of identifications. Various examples from chip-level to board-level are used to demonstrate the performance of the proposed framework.
  • Keywords
    integrated circuit packaging; time-frequency analysis; transient analysis; board-level; chip-level; data points; discrete-time domain identification framework; electronic packaging structures; hybrid frequency-time-domain macromodeling; identification process; implicit information; linear macromodeling; post-processing techniques; preprocessing techniques; sampled structure response; transient simulations; Chebyshev approximation; Computational modeling; Delay; Time domain analysis; Time frequency analysis; $P$-norm identification; discrete-time domain; frequency warping; hybrid-domain; implicit information; macromodeling; system identification; vector fitting;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2245179
  • Filename
    6466376