Title :
Wafer Map Failure Pattern Recognition and Similarity Ranking for Large-Scale Data Sets
Author :
Ming-Ju Wu ; Jang, Jyh-Shing R. ; Jui-Long Chen
Author_Institution :
Dept. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
Wafer maps can exhibit specific failure patterns that provide crucial details for assisting engineers in identifying the cause of wafer pattern failures. Conventional approaches of wafer map failure pattern recognition (WMFPR) and wafer map similarity ranking (WMSR) generally involve applying raw wafer map data (i.e., without performing feature extraction). However, because increasingly more sensor data are analyzed during semiconductor fabrication, currently used approaches can be inadequate in processing large-scale data sets. Therefore, a set of novel rotation- and scale-invariant features is proposed for obtaining a reduced representation of wafer maps. Such features are crucial when employing WMFPR and WMSR to analyze large-scale data sets. To validate the performance of the proposed system, the world´s largest publicly accessible data set of wafer maps was built, comprising 811 457 real-world wafer maps. The experimental results show that the proposed features and overall system can process large-scale data sets effectively and efficiently, thereby meeting the requirements of current semiconductor fabrication.
Keywords :
failure analysis; feature extraction; image recognition; large-scale systems; pattern recognition; semiconductor device manufacture; WMFPR; WMSR; large-scale data sets; rotation invariant features; scale invariant features; semiconductor fabrication; sensor data; wafer map data; wafer map failure pattern recognition; wafer map similarity ranking; Fabrication; Feature extraction; Pattern recognition; Semiconductor device modeling; Support vector machines; Transforms; Data models; data models; image recognition; information retrieval; pattern recognition; semiconductor defects;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2014.2364237