DocumentCode :
632980
Title :
Comparative analysis between methodologies and their software realizations applied to modeling and simulation of industrial thermal processes
Author :
Dimitrov, B. Hr ; Nenov, H.B. ; Marinov, A.S.
Author_Institution :
Dept. of Electr. Eng., Tech. Univ. of Varna, Varna, Bulgaria
fYear :
2013
fDate :
20-24 May 2013
Firstpage :
891
Lastpage :
895
Abstract :
The current paper presents a comparative analysis between numerical computer based methods applied towards modeling of thermal processes. The processes that are analyzed concern equipment based on electrical resistance heating - such as chamber resistive, blast and through furnaces. The study applies computer based modeling, using the finite element method (FEM) and the system of ordinary differential equations (SODE) method in order to solve different problems involving technological thermal processes such as: controlled heating for quenching, melting, forced cooling and others. Modeling capabilities for temperature control trough hysteresis and PID regulation are shown. Results from using FEM and SODE for solving those different tasks are combined to form a uniform comparative study that formulates recommendations for selecting the most appropriate modeling method for the specific thermal process.
Keywords :
blast furnaces; control engineering computing; differential equations; finite element analysis; melting; numerical control; process control; production engineering computing; quenching (thermal); resistance furnaces; temperature control; three-term control; FEM; PID regulation; blast furnaces; chamber resistive furnaces; computer based modeling; electrical resistance heating; finite element method; forced cooling; hysteresis; industrial thermal process modeling; industrial thermal process simulation; melting; numerical computer based methods; quenching; software realizations; system-of-ordinary differential equations method; temperature control; through furnaces; Computational modeling; Finite element analysis; Furnaces; Heating; Load modeling; Mathematical model; Thermal loading;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Information & Communication Technology Electronics & Microelectronics (MIPRO), 2013 36th International Convention on
Conference_Location :
Opatija
Print_ISBN :
978-953-233-076-2
Type :
conf
Filename :
6596383
Link To Document :
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