• DocumentCode
    633249
  • Title

    Fiber bundle type fan-out for multicore Er doped fiber amplifier

  • Author

    Watanabe, K. ; Saito, Takashi ; Tsuchida, Yukihiro ; Maeda, Kumiko ; Shiino, Masato

  • Author_Institution
    FITEL Photonics Lab., Furukawa Electr. Co., Ltd., Chiba, Japan
  • fYear
    2013
  • fDate
    June 30 2013-July 4 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We achieved connection loss <; 0.5dB between fiber bundle type fan-out (FBF) and MC-EDF by matching the mode field diameters of each fiber. This low connection loss realized NF improvement about 0.7dB.
  • Keywords
    erbium; optical communication equipment; optical fibre amplifiers; optical fibre fabrication; optical fibre losses; FBF; MC-EDF; connection loss; fiber bundle type fan-out; mode field diameter matching; multicore erbium doped fiber amplifier; Bonding; Gain; Multicore processing; Noise measurement; Optical fiber amplifiers; Optical fiber communication; Optical losses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    OptoElectronics and Communications Conference held jointly with 2013 International Conference on Photonics in Switching (OECC/PS), 2013 18th
  • Conference_Location
    Kyoto
  • Type

    conf

  • Filename
    6597384
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=633249