DocumentCode
633270
Title
Optical transceiver ICs based on 3D die-stacking of opto-electronic devices
Author
Duan, Pinxiang ; Raz, Oded ; Dorren, Harmen Js
Author_Institution
Eindhoven Univ. of Technol., Eindhoven, Netherlands
fYear
2013
fDate
June 30 2013-July 4 2013
Firstpage
1
Lastpage
2
Abstract
We review a wafer-scale process for making compact 3D stacked transmitter and receivers ICs. We show experimental results that indicate that error-free operation of the transmitter at 10 Gbps can be obtained over 500m transmission through OM4-Plus fiber.
Keywords
integrated circuits; optical transceivers; optoelectronic devices; 3D die-stacking; OM4-Plus fiber; bit rate 10 Gbit/s; compact 3D stacked receivers; compact 3D stacked transmitter; distance 500 m; optical transceiver IC; optoelectronic devices; wafer-scale process; Bonding; Integrated circuits; Optical fiber dispersion; Optical transmitters; Receivers; Three-dimensional displays; Vertical cavity surface emitting lasers; 3D Integration; optical interconnects; optical transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
OptoElectronics and Communications Conference held jointly with 2013 International Conference on Photonics in Switching (OECC/PS), 2013 18th
Conference_Location
Kyoto
Type
conf
Filename
6597405
Link To Document