• DocumentCode
    633843
  • Title

    Design flow and techniques for fault-tolerant ASIC

  • Author

    Stamenkovic, Z. ; Petrovic, V. ; Schoof, G.

  • Author_Institution
    IHP, Frankfurt (Oder), Germany
  • fYear
    2013
  • fDate
    15-19 July 2013
  • Firstpage
    93
  • Lastpage
    98
  • Abstract
    The paper presents a design flow for fault-tolerant CMOS ASICs which are immune to the single event upsets (SEU), the single event transients (SET), and the single event latchup (SEL). Triple and double modular redundant (TMR and DMR) circuits and SEL protection switches (SPS) make the base for design of the highly reliable ASIC. The SPS had been designed, characterised, and verified before it became a standard library cell. The proposed design flow requires the standard design automation tools and a few additional steps during logic synthesis and layout generation. An extra step is necessary to generate the redundant design net-list including voters. Other two extra steps (definition of the power domains and placement of the SPS) have to be performed in the layout phase. The concept has been verified on the example of a shift-register.
  • Keywords
    CMOS logic circuits; application specific integrated circuits; integrated circuit layout; integrated circuit reliability; logic design; radiation hardening (electronics); shift registers; SEL protection switches; SET; SEU; SPS placement; design flow; double-modular redundant circuit; fault-tolerant CMOS ASIC; highly-reliable ASIC; layout generation; layout phase; logic synthesis; power domain definition; redundant design net-list; shift-register; single-event latchup; single-event transients; single-event upsets; standard design automation tool; standard library cell; triple-modular redundant circuit; Circuit faults; Fault tolerance; Fault tolerant systems; Integrated circuit modeling; Switches; Transistors; Tunneling magnetoresistance; ASIC design; Single event effect; fault tolerance; latchup protection switch; triple and double modular redundancy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
  • Conference_Location
    Suzhou
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-1241-4
  • Type

    conf

  • DOI
    10.1109/IPFA.2013.6599133
  • Filename
    6599133