Title :
Composition distribution studies of Sn/Ag/Cu solder material using TOF-SIMS, XPS and EDX
Author :
Lee, Hwang Soo ; Xing, Z.X. ; Gui, D. ; Hao, Miao ; Shao, J.J. ; Khoo, B.S. ; Shen, Y.Q. ; Li, X.M.
Author_Institution :
WinTech Nano-Technol. Services Pte Ltd., Singapore, Singapore
Abstract :
Determination of compositional distribution for solder material is of particular interest in the area of failure analysis, specifically in the investigation of various solder alloy formations during the joining processes and interconnection failures. In this paper, we explored several advanced techniques such as time-of-flight secondary ion mass spectrometry (TOF-SIMS), X-ray photoelectron spectroscopy (XPS) and energy-dispersive X-ray spectroscopy (EDX) for characterizing the composition of SnAgCu solder material. Each analysis technique has its advantages in the information attained, thus stimulating multi-technique approaches for material analysis in future.
Keywords :
X-ray chemical analysis; copper; failure analysis; interconnections; secondary ion mass spectroscopy; silver; solders; tin; EDX; Sn-Ag-Cu; TOF-SIMS; X-ray photoelectron spectroscopy; XPS; composition distribution; energy-dispersive X-ray spectroscopy; failure analysis; interconnection failures; joining process; material analysis; multitechnique approach; solder alloy formation; solder material; time-of-flight secondary ion mass spectrometry; Backscatter; Integrated circuits; Joints; Lead; Sputtering; Tin; 3-D ion image; EDX; SnAgCu solder material; TOF-SIMS; XPS;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599145
