Putting the die contour back - Methods in advanced sample preparation for 3D and flip-chip devices

Utilizing existing sample preparation techniques and/or toolsets in the typical failure analysis lab is an effective way of reducing the bottlenecks on higher-demand contour milling machines. Methodologies for faster milling on contouring machines, and use of a through-silicon measurement tool (used for measuring remaining silicon thickness), will demonstrate how to achieve higher throughput in the lab while preserving or reintroducing the device bows/warps that were present at the start.